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Electronics is Easy?

What does Industry need?

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Industry needs Electrical Engineers who understand electronic fundamentals. These video clips provide those fundamentals.

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When I interview Electrical Engineering students, I ask them basic electronic questions such as:  1) Sketch an Op Amp with a gain of ten, and 2) What is the difference between a BJT and FET transistor.

A majority of EE students do not know.

Those who do know, make it to a second interview.  I ask questions such as: 3) What is capacitor ESR, 4) What is slew rate vs. bandwidth, 5) What language do you use for programming a microcontroller.

The few who make it through these questions are commonly invited to visit the company for a third round of interviews.

Knowing electronic fundamentals does not guarantee an electronic design engineer job.  But it increases the odds.

In addition, for those who understand electronic fundamentals and produce results, the odds are increased they will be promoted and assigned challenging projects.
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The contents strive to be clear and concise. The intent is to prepare Electrical Engineering students for the world of electronics.

These video clips are based on many years of electronic design experience.

They start at a middle school grade level. They end at a college student level.

Chapter 1
Electronic Basics

1.1 Basics
--- garden hose, batteries, voltage, resistance, current, flashlight ---
1.2 Voltage Current Resistance
--- battery, voltage volts, resistor ohms, current amps, equations ---
1.3 Voltage (DC vs. AC)
--- direct current, alternating current, frequencies, guitar string, cycles per second, Hz, Hertz ---
1.4 Electromagnetism
--- electricity, electric current, magnets, wire, power plants, motors ---

Chapter 2
Analog Passive Components

2.1 Component Physical Packages
--- PTH, pin thru hole, SMT, surface mount technology, PCB, printed circuit board, fiberglass, solder ---
2.2 Resistor Parameters
--- ohms, value, accuracy, tolerance, power rating, temperature coefficient, material composition, decade multiples ---
2.3 Parallel and Series Resistors
--- resistor equations, voltage dividers, split current, mA, milliamps ---
2.4 Capacitors (DC)
--- direct current, farads, microfarad, nanofarad, picofarad, equations, voltage charge rate / rise time, time t = 0 ---
2.5 Capacitor Parameters
--- value, material composition, dialectric, accuracy, tolerance, voltage rating, derating, voltage polarization, Equivalent Series Resistance (ESR), ceramic, tantalum, metal film, paper, mylar film, aluminum, electrolytic, c0g, np0, npo, x7r, x5r, z5u, y5v, class 1, class 2, datasheets ---
2.6 Parallel and Series Capacitors
--- Equivalent Series Resistance (ESR), noise reduction, bypass caps, RC filters, tantalum, ceramic ---
2.7 Capacitors (AC) RC Filter
--- alternating current, resist voltage changes, capacitive reactance, value size, frequency, amplitude, phase, low pass filter, equations, cutoff frequency, corner frequency, break frequency, Bode plots, -3 dB, -20 dB, -6 dB, phase shift ---
2.8 Cascade RC Filters
--- SPICE models, Bode plots, double cascade, op amp, trial and error, trade-offs ---
2.9 Inductors (DC)
--- direct current, resist current changes, henries, henry, millihenry, microhenry, equations, current change rate, material compositions ---
2.10 Inductors (AC) RL Filters
--- chokes, restrict current flow, separate frequencies, RL filter cutoff frequency equation, phase shift ---
2.11 Impedance
--- resistant to voltage changes and current changes, amplitude changes and phase changes ---
2.12 Crystals
--- constant precise frequency, wireless, wired communication, watches clocks, resonators, oscillators, kilohertz, megahertz ---
2.13 Fuses
--- disrupt current flow, soldering fuse constraints, resettable fuse ---
2.14 Transformers
--- electricity, step up, step down, closely coupled inductors, AC current, magnetic field, primary, secondary windings, losses, generating stations, high voltage transmission lines, substations, 120 / 240 V volts ---
2.15 Common Mode Chokes
--- highly coupled 1:1 transformer, attenuates electronic noise, EMC, allows AC when current in equals current out, allows communication ---
2.16 Hall Sensors
--- detects stationary magnets / magnetic fields, location and distance, proximity, positioning, current sensing, speed detection ---

Chapter 3
Analog Discrete Active Components

3.1 Diodes
--- anode, cathode, forward voltage drop, leakage current, forward current maximum, reverse voltage minimum, datasheets ---
3.2 LEDs
--- light emitting diodes, long life, low current, indicators, visual grids, illumination ---
3.3 Diode Rectifiers
--- half-wave rectifier, full-wave rectifier, AC to DC conversions ---
3.4 Zener Diodes
--- accurate reverse voltage drop, forward voltage drop, leakage current ---
3.5 FETs (Field Effect Transistors)
--- controls current, controlled by voltage, P channel, N channel, enhancement, depletion, MOSFET, gate, source, drain, gate source threshold voltage, power considerations ---
3.6 JFETs (Junction Field Effect Transistors)
--- controls current, controlled by voltage, similar to FET, no enhancement mode ---
3.7 BJTs (Bipolar Junction Transistors)
--- controls current, controlled by current, PNP, NPN, base, emitter, collector, base-emitter saturation voltage ---
3.8 Analog Switches
--- controlled with voltage, bidirectional, internal resistance, bandwidth ---
3.9 Digital Potentiometers
--- changes resistance values electronically, SPI communication, micro ---
3.10 Optoisolators
--- optocouplers, photocouplers, LED, phototransistor, galvanic isolation ---

Chapter 4
Analog Microcircuit Active Components

4.1 Comparators
--- compares voltages, IC, integrated circuit, powered by positive / negative voltages / ground, hysteresis, open drain / collector ---
4.2 Op Amps
--- positive gain, negative gain, unity gain, input offset voltage, input bias current, bandwidth, slew rate, trade-offs ---
4.3 Op Amp Offset
--- offset voltage, positive gain / offset, negative gain / offset, AC voltage input / offset ---
4.4 Variable Gain and Variable Offset Op Amp
--- digital potentiometers, micros, microprocessors, micro processors, microcontrollers, micro controllers, controlled gain / offset ---
4.5 Differential Op Amp
--- differential input, increased signal amplification, reduced noise amplification ---
4.6 Differential Input and Differential Output Op Amp
--- signals from one PCB to another PCB, can result in noisy ground ---
4.7 Differential Input and Differential Output Op Amp Filtering
--- differential filter, differential output RC filter, differential gain resistor RC filter ---
4.8 Rail-to-Rail Op Amps
--- approach power voltage and ground, inaccurate output results ---
4.9 Constant Current / Voltage
--- resistor bridges, pressure sensors, constant current / voltage ---
4.10 Instrumentation Amps
--- CMRR, common mode rejection, 20 log, differential input amplifier ---
4.11 Voltage Regulators
--- linear regulator, switching regulator, LDO, low dropout drop out, positive to negative voltages, dual double voltage output, power efficiency, power in, power out, low battery current, noisy power supply ---
4.12 Voltage References
--- accurate, little noise, stable over temperature, ADCs, ADC's, DACs, DAC's, analog electronics ---
4.13 Voltage Supervisors
--- monitor power supply voltages, watchdog watch dog timers, digital pulses, thresholds, reset micros, microprocessors, microcontrollers ---

Chapter 5
Digital

5.1 Digital Component Basics
--- logic gates, noise tolerant, voltage level for ones "1's" and zeros "0's", inverter gate, and gate, nand gate, or gate, nor gate, open drain, voltage level shift, source current, sink current, switch debounce ---
5.2 Binary and Hex Numbers
--- 10001000b, 0xA, 0xB, 0xC, 0xD, 0xE, 0xF ---
5.3 Byte Integer Signed Unsigned
--- MSB, LSB, 2's complement ---
5.4 Float and Double Numbers
--- precision, IEEE 754 Floating Point Standard, MSB sign bit, exponent, mantissa ---
5.5 Electronic Analog to Digital Converter (ADC)
--- convert voltage amplitudes into binary numbers for micros, microprocessors microcontrollers, resistor ladders, 2 4 8 10 12 16 18 24 32 bit, voltage references, Nyquist sampling criterion, sample clocks, accuracy, resolution, sample rate, cycle latency, power consumption, Delta Sigma, SAR, Pipeline, conversion rate, differential ---
5.6 Electronic Digital to Analog Converter (DAC)
--- convert binary numbers into voltage amplitudes, micros, microprocessors, microcontrollers, resistor ladders, 2 4 8 10 12 16 18 24 32 bit, voltage references, Delta Sigma, Resistor String (R-2R, MDAC), Current Steering, resolution, settling times, linearity ---
5.7 Electronic Microprocessors and Microcontrollers
--- Code is binary numbers that provide instructions to micros (microprocessors microcontrollers) microprocessors for computers, microcontrollers for specific tasks (phones, cars, robotics, medical devices) ---
5.8 Electronic Watchdog Timers
--- Watchdog timers reset micros (microprocessors microcontrollers), periodic pulses, excessive electronic noise ---
5.9 Electronic Memory
--- RAM, ROM, FLASH, EEPROM, FRAM, NRAM, Non-Volitile Memory (NVM), change limitation ---
5.10 Electronic Firmware and Software Code
--- Assembly, C, human readable code, binary number code, IDE (Integrated Development Environment), source editor, compiler / assembler, uploader, debugger, PC program counter, TitleCase, Hungarian notation ---
5.11 Electronic Parallel Communication
--- Transmit and receive binary numbers to RAM and from RAM ---
5.12 Electronic SPI Serial Communication
--- Transmit and receive binary numbers between a Master and Slave(s), reduced real estate ---
5.13 Electronic I2C Serial Communication
--- Transmit and receive binary numbers between a Master and Slave(s), reduced real estate ---
5.14 Electronic RS-232 RS-485 Serial Communication
--- Transmit and receive binary numbers between computers and equipment, asynchronous communication, 9600 baud, 8-N-1, 8-E-1, 8-O-1, DB9 connector, start and stop bits, even / odd parity ---
5.15 Electronic Little Endian / Big Endian
--- Transmit and receive binary numbers between computers, serial communication, LSB (Least Significant Bit), MSB (Most Significant Bit) ---

Chapter 6
EMC (Electro-Magnetic Compatibility)

6.1 Electronic EMC Design Considerations
--- Electromagnetic Compatibility, Not emit electromagnetic energy that could interfere with other devices, Not susceptible to external electromagnetic energy, Cables, Metallic Shielding, Electronic Assemblies, Passive Components, Active Digital Components, Active Analog Components, Tradeoffs ---
6.2 Electronic Transient Voltage Suppressors
--- TVS, limited lightning protection, high voltage spike protection ---
6.3 Electronic EMC Common Mode Chokes
--- Filter that allows AC signals when current in equals current out ---
6.4 Electronic Ferrite Cores
--- Reduce EMC from motor electrical noise ---

Chapter 7
Important Electronic Details

7.1 Electronic Datasheets
--- Necessary for solid electronic design! Document that specifies component characteristics (created by component mfg company) includes nominal value, tolerances, parameter changes due to temperature, min / max ratings (supply voltage, power consumption, I/O currents), IC pin descriptions, timing diagrams / speed / response times, overheating details that could destroy, physical location of components around sensitive ICs. ---
7.2 Electronic SPICE Models
--- SPICE model computer programs predict “end results” (programs such as Micro-Cap, TINA, LTspice, and PSPICE), vary component tolerances, change temperatures, estimate worst cases. ---
7.3 Electronic Counterfeit Components
--- Counterfeit electronic components "major” hazard. A counterfeit component may perform “similarly”, but may not be as accurate, may fail quickly, may fail over temperature changes. ---
7.4 Electronic PCBs (Printed Circuit Boards)
--- Fiberglass with copper foil, copper weight / thickness (0.5 oz, 1 oz, 2 oz), vias, pads, multi-layer, HASL, ENIG, OSP, soldermask, silkscreen ---
7.5 Electronic Ground Loops
--- Avoid multiple connections of ground to ground (only one connection), ground planes are an exception ---
7.6 Electronic PCB Fabrication
--- Ensure inner layers and external layers are clean else dendrite growth can lead to failures, precision locations for holes, pads, vias, fiducials, flexibility can crack solder joints and components ---
7.7 Electronic Solder
--- Attached electronic components to PCBs, new solder is tin only, flux is cleaning agent, remove flux to avoid unwanted resistive path which could lead to product failure ---
7.8 Electronic Tin Whiskers
--- Solder with no lead leads to tin whiskers, unwanted connections between components, and lead to product failure, only 0.49 of lead usage is for electronics, batteries (cars, etc.) are 80% ---
7.9 Electronic Conformal Coating and Potting
--- Protect electronics from toxic gases, can expand which could pop loose components from PCBs ---
7.10 Electronic Liquid Glass
--- Tin whiskers, microspheres, glass, ceramic, car paint ---

Chapter 8
Electronic Documentation

8.1 Electronic Technical Specifications
--- Performance requirements, marketing specifications, customer needs, customer may not know of new technologies ---
8.2 Electronic Schematics
--- Electronic component locations relative to each other reference designators, values, signal names ---
8.3 Electronic BOM (Bill of Materials)
--- List of all electronic components with names, component manufacturing company name, and component part numbers. requires zero errors ---
8.4 Electronic PCB Layouts
--- Mechanical Requirements Drawing, PCB Netlist, Schematic Netlist, DFM (Design for Manufacturability), DFT (Design for Testability), PCB Fabrication, Solder Mask, Silkscreen ---

Chapter 9
Electronic Tests

9.1 Electronic Design Verification Test
--- Performance, min & max power voltage, current consumption, power interruption, reverse polarity, customer connection error, temperature and humidity, shock & vibration ---
9.2 Electronic EMC Test
--- Radiated Emissions, Conducted Emissions, Radiated Immunity, Conducted Low Frequency EM Immunity, Electrostatic Discharge (ESD) Immunity, Electrical Fast Transient (EFT) Burst Immunity, Surge Immunity, Magnetic Field Immunity, Voltage Dips and Interrupts ---
9.3 Electronic Firmware Verification Test
--- Verify microprocessor code and microcontroller code handles all inputs, all errors, all situations ---

Chapter 10
Electronic Manufacturing

10.1 Electronic Manufacturing Components
--- Verify correct components, supply chain to avoid counterfeit components, audit, AQL (Acceptable Quality Levels) ---
10.2 Electronic Manufacturing Kitting
--- All components are available prior to scheduling the assembly build ---
10.3 Electronic Manufacturing ESD
--- Electro-Static Discharge protection requirements, anti-static clothes, gloves, boxes, mats, wrist straps ---
10.4 Electronic Manufacturing SMT
--- Small components, small assemblies, easy and fast to mount with robotic equipment, reduced costs ---
10.5 Electronic Manufacturing SMT Machines
--- Solder paste dispenser, stencil, robotic machines, correct component / orientation, reels / tubes, fiducials, re-flow ovens, thermal profile ---
10.6 Electronic Manufacturing Wave Solder
--- Molten solder, conveyor, PTH components, avoid SMT large, BGA, find pitch components on bottom side, heat / cool profile ---
10.7 Electronic Manufacturing Solder Fountain
--- Tub of molten solder, shape / size matches PTH components shape / size ---
10.8 Electronic Manufacturing Hand Solder
--- Other solder options not feasible, fix solder joint problems, soldering iron, solder wire, solder wick / vacuum tool ---
10.9 Electronic Manufacturing Cleaning
--- Remove contaminants, flux, reduce odds of product inaccuracy / failure ---
10.10 Electronic Manufacturing ICT
--- In-Circuit Test fixture, pogo-pins, verify component value / orientation, test voltages, download firmware code / data to micros / flash ---
10.11 Electronic Manufacturing Functional Test
--- Verify assembly built correctly, connections, voltages, I/O signals, no errors, temperature changes, calibrate sensors ---
10.12 Electronic Manufacturing Final Actions
--- Conformal coating / potting, post pot test, ESD bags ---

Chapter 11
Electronic Synopsis

Copyright © 2015 by Clyde T. Eisenbeis
Copyright © 2020 by Clyde T. Eisenbeis

All rights reserved.  No part of these video clips may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of the author.

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